MediaTek Dimensity 9000+: New flagship SoC competes against Qualcomm Snapdragon 8+ Gen 1

With the MediaTek Dimensity 9000+, the company unveiled its new flagship SoC for smartphones in Taiwan on June 22, with which it wants to compete against the optimized Qualcomm Snapdragon 8+ Gen 1. At its core, this is also an improved version of the already known 9000 chip that primarily wants to attract attention with faster clock rates. The current top model is used, for example, in the Honor 70 Pro+.

MediaTek Dimensity 9000+ with higher CPU and GPU clock rates

The new MediaTek Dimensity 9000+ system-in-chip (SoC) relies on ARM’s v9 CPU architecture via octa-core processor, which is manufactured in 4nm process and should therefore be particularly energy-efficient.

The most powerful ARM Cortex-X2 performance core now reaches a clock rate of up to 3.2 GHz compared to 3.05 GHz in the predecessor. It is supported by three Cortex-A710 cores (2.85 GHz) and four efficient Cortex-A510 cores. Overall, the processor performance of the Dimensity 9000+ should increase by 5 percent as a result.

The graphics performance even climbs by a whole ten percent compared to the Dimensity 9000. However, the ARM Mali-G710 MC10 GPU still only uses 10 of the total 16 cores, which is probably why MediaTek has mainly increased the clock rates.

The manufacturer does not reveal how high this is. So far, the GPU has been clocked at a maximum of 850 MHz and was thus higher than Qualcomm’s Adreno-730 GPU, which was used in the Snapdragon 8 Gen 1.

Other than that, nothing changes

Otherwise, nothing changes in the technical features of the MediaTek Dimensity 9000+ compared to the 9000. The highlight in the form of the Imagiq 790 ISP image processor thus remains. It is capable of processing an impressive 9 gigapixels per second and simultaneously recording HDR videos on three camera lenses.

Individual cameras can have a resolution of 320 megapixels, at least in theory. In practice, however, we are still far away from these values. 4K HDR videos can even be recorded with AI noise reduction thanks to the image processor, which also works effectively and quickly with photos.

Also included in the Dimensity 9000+ is MediaTek MiraVision 790, which, among other things, brings support for 144 Hz fast WQHD+ displays or 180 Hz fast Full HD panels and allows HDR10+ Adaptive playback.

In addition, a modem is directly integrated into the SoC. Wi-Fi6E is supported, as well as Bluetooth 5.3, so it is an exciting chip. The first smartphones with MediaTek Dimensity 9000+ should reach retailers in the third quarter of 2022. The new Realme GT Neo 3, for example, still uses the 8100 model, but the manufacturer should have a few more smartphones up its sleeve. You can find more details on the manufacturer’s product website.